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Brand Name : ACCPCB
Model Number : SP1111
Certification : ISO, UL, SGS,TS16949
Place of Origin : China
MOQ : 1 PCS
Price : Negotiable
Payment Terms : L/C / T/T / Western Union / Paypal
Supply Ability : 20000SQ.M/Per Month
Delivery Time : 10-12days
Packaging Details : Vacuum packing with desiccant
Material : Copper PCB Boards
Layer : 1 Layer
Thickness : 3.2mm
Copper Thickness : 1OZ
Surface Finish : Immersion Gold
Special Process : Thermoelectric Separation
Round Copper Based PCB 3mm Thickness Single Layer Immersion Gold Surface Finishing
Key Specifications:
| Material : | copper pcb |
| Layer : | 1 layer |
| Board Thickness : | 3.2mm |
| surface copper thick : | 35um |
| Min.Line Width : | 9mil |
| Min.Space : | 9mil |
| Min.Hole Size : | 6mm |
| Solder process : | immersion gold |
| Thermal conductivity : | 200W |
| Special process : | thermoelectric separation |
Quality assurance:
Every production process has a special person to test to ensure quality, AOI, E-testing, Flying Probe Test.
Have professional engineers to check the quality
All products have passed CE, FCC, ROHS and other certifications
FOB Port : Hongkong / Shenzhen Lead Time : 7-15 days
HTS Code : 8534.00.10 Dimensions per Carton: 37X27X22mm
Weight Per Carton : 20 Kilograms
FAQ:
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
6. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
7. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

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Round Copper Based PCB 3mm Thickness Single Layer Immersion Gold Surface Finishing Images |