10 Layer Fr4 TG150 ENIG High Density PCB For High Voltage Equipment
Production description :
this board is 10layer with 2oz copper thickness. it is used on high voltage equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
| Production Types: | Rigid PCB |
| Layer : | 10 Layers |
| Base Material : | FR4 |
| Copper Thickness : | 2 oz |
| Board Thickness : | 1.8 mm |
| Min. Finish Hole Size : | 8 mil (0.10mm) |
| Min. Line Width : | 4 mil |
| Min. Line Spacing : | 4 mil |
| Surface Finishing : | ENIG |
| Drilling hole tolerance: | +/-3 mil ( 0.075mm ) |
| Min Outline tolerance : | +/-4 mil ( 0.10mm ) |
| Working panel size : | max:1200mmX600mm (47'' X24'') |
| Outline profile: | Punching, Routing , CNC routing + V-cut |
| Solder mask : | LPI Solder mask, Peelable mask |
| Solder Mask Color : | Blue, black,yellow, matte green |
| Certificate : | UL, CQC, TS16949, ISO14000, ROHS |
| Silkscreen color : | White |
| Twist and Bow : | no more than 0.75 % |
PCB Flow Chart.pdf
Products Application:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.
Rigid PCB Technical Capability:
| Items | Technical Capability |
| Layers | 1-28 layers | Min. line width/space | 4mil |
| Max.board size (single&doule sided) | 600*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish | HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm |
| Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
| Base copper thickness(Inner and outer layer) | Min. thickness: 0.5 OZ Max.thickness: 6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ | Max.board thickness(single&doule sided) | 3.20mm |
Advantages:
• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery
Lead Time :
| Lead Time | 2 /L | 4 /L | 6/ L | 8/ L |
| Sample Order | 3-5days | 6-8days | 10-12days | 12-14days |
| Mass Production | 7-9days | 8-10days | 12-15days | 15-18days |
Product Tags:
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Ten Layer Fr4 TG150 ENIG High Density PCB For High Voltage Equipment Images
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